MTD5P06VT4【PDF 1/7 页】MOSFET P-CH 60V 5A DPAK

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MTD5P06V

Preferred Device

Power MOSFET

5 Amps, 60 Volts P?Channel DPAK

This Power MOSFET is designed to withstand high energy in the

avalanche and commutation modes. Designed for low voltage, high

speed switching applications in power supplies, converters and power

motor controls, these devices are particularly well suited for bridge

circuits where diode speed and commutating safe operating areas are

http://onsemi.com

critical and offer additional safety margin against unexpected voltage

transients.

Features

? Avalanche Energy Specified

? I DSS and V DS(on) Specified at Elevated Temperature

? Pb?Free Packages are Available

V (BR)DSS

60 V

R DS(on) TYP

340 m W

P?Channel

I D MAX

5.0 A

MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)

Rating

Drain?to?Source Voltage

Drain?to?Gate Voltage (R GS = 1.0 M W )

Gate?to?Source Voltage

? Continuous

? Non?repetitive (t p ≤ 10 ms)

Symbol

V DSS

V DGR

V GS

V GSM

Value

± 15

± 25

Unit

Vdc

Vpk

MARKING

DIAGRAM

Drain Current ? Continuous @ 25 ° C

? Continuous @ 100 ° C

? Single Pulse (t p ≤ 10 m s)

I D

I DM

Adc

Apk

Drain

Total Power Dissipation @ 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 2)

P D

0.27

2.1

W/ ° C

1 2

DPAK

CASE 369C

STYLE 2

Operating and Storage Temperature Range

Single Pulse Drain?to?Source Avalanche

Energy ? Starting T J = 25 ° C

T J , T stg

E AS

?55 to

175

125

° C

Gate

Drain

Source

(V DD = 25 Vdc, V GS = 10 Vdc, Peak

I L = 5 Apk, L = 10 mH, R G = 25 W )

= Year

Thermal Resistance

° C/W

= Work Week

Junction?to?Case

Junction?to?Ambient (Note 1)

Junction?to?Ambient (Note 2)

R q JC

R q JA

3.75

100

71.4

5P06V

= Device Code

= Pb?Free Package

Maximum Lead Temperature for Soldering

Purposes, 1/8 ″ from Case for 10 seconds

T L

260

° C

ORDERING INFORMATION

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using the minimum recommended

pad size.

2. When surface mounted to an FR?4 board using the 0.5 sq in drain pad size.

Device

MTD5P06V

MTD5P06VT4

MTD5P06VT4G

Package

DPAK

Shipping ?

75 Units/Rail

2500/Tape & Reel

(Pb?Free)

?For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Preferred devices are recommended choices for future use

and best overall value.

? Semiconductor Components Industries, LLC, 2006

July, 2006 ? Rev. 6

Publication Order Number:

MTD5P06V/D

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